 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
 |
|
|
|
|
 |
|
 |
| GSM-GPS
MODULE: A2D JP
|
|
A2D
JP is based on chipset combination of Wavecom-Conexant
or Siemens-SiRF. These are intended for OEMs with
requisite expertise in PCB designing, and RF. These
modules can be embedded by the OEMs in their products,
or converted to smart end terminals for usages as
GSM-GPS modems.
|
|
| Dimensions |
95
mm x 50 mm x15 mm .
|
| Weight |
60
g
|
| Power
Supply |
GSM
VC5 5.0V
DC.
GPS
VC3 3.3V
DC.
|
| Temperature
Limits |
Operation
-20 to +55 deg C.
Storage
-20 to +70 deg C.
|
| Interface |
| Interface
A |
60
pin connector AMP 177984-2
|
| Interface
B |
GPS
50 ohms for active 3V GPS ant.
|
| Interface
C |
GSM
50 ohm SMB male.
|
| Interface
D |
SIM
card reader for small cards (3V)
|
|
| GSM |
E-GSM
and DCS (GSM ETSI Phase I and II).
|
|
333……144
000 bps, asynchronous, transparent and
non-transparent
(V.21, V.22, V.23, V.22bis, V.26ter,
V.32,
V.34, V.110).`
|
EGSM
Sensitivity
< -104 dBm.
|
DCS
Sensitivity
< -100 dBm.
|
| Max/Min
output EGSM
|
31-35 dBm/0
to 10
dBm.
|
| Max/Min
output DCS
|
28-32 dBm/-5 to 5
dBm.
|
| SIM
Card Reader
|
Internal, for small
cards (3V).
External,
10..15 cm max cable length.
|
|
|
RS
232
|
|
| GPS |
As
in JP2, and JP3 earlier.
|
|
|
|
|
|
 |
 |
|
 |
 |
|
 |
|
 |
|
 |
|
 |
 |
|
 |
 |
|
 |
 |
|
 |
|
|
|
|
|
|